Prime Minister Mark Carney Announces $60 Million to Build Advanced Silicon Packaging Hub in Ottawa

OTTAWA, ON — Prime Minister Mark Carney and Minister of Innovation, Science and Industry François-Philippe Champagne visited the Kanata North Technology Park to announce a $60 million federal investment from the Strategic Innovation Fund to build Canada’s first commercial Advanced Silicon Packaging and Heterogeneous Integration Foundry.

Establishing Domestic Semiconductor Sovereignty for Telecom and Defense

The $150 million state-of-the-art microelectronics facility will feature cleanroom packaging lines capable of assembling 3D optical and radio frequency (RF) chiplets for satellite communications, 6G telecommunications, and quantum computing processors. The commercial packaging foundry fills a critical gap in North American semiconductor supply chains, allowing Canadian fabless chip design startups to package prototypes domestically rather than relying on Asian packaging facilities.

Prime Minister Carney emphasized that domestic semiconductor packaging capacity is essential for economic security, high-tech manufacturing, and global technology leadership.

Semiconductor Council and Tech Sector Endorse

The Semiconductor Alliance of Canada praised the investment, noting that packaging now accounts for 50% of semiconductor performance gains.

Carleton University and University of Ottawa engineering faculties established specialized microelectronics graduate co-op programs.

Cleanroom Commissioning Schedule

Foundry cleanroom construction in Kanata will commence in November 2026, with prototype packaging operations starting in early 2028.